multi-layer board

we can supply the mobile phone board/HDI

Technologies Requirement:layer: 8 layersMaterial: FR-4Thinkness: 1.0mm/1.0TFinish: Immersion NI/AUMIN.Hole size: 0.1mm(4mil)min.line width/space: 0.075/0.075(3mil/3mil)special:blind&;burried+
10 layer pcb board/printed circuit board/rigd board/HDI

Technologies Requirement:layer: 10 layersMaterial: FR-4 TG170Thinkness: 1.6MM/1.6TFinish: Immersion NI/AU/HASLMIN.Hole size: 0.1mm(4mil)min.line width/space:
mobile phone board/HDI

Technologies Requirement:layer: 6 layersMaterial: FR-4Thinkness: 1.0mm/1.0TFinish: Immersion NI/AUMIN.Hole size: 0.1mm(4mil)min.line width/space: 0.075/0.075(3mil/3mil)special:blind&;burried+
mobile phone board/PCBA

Technologies Requirement:layer: 6 layersMaterial: FR-4Thinkness: 1.0mm/1.0TFinish: Immersion NI/AUMIN.Hole size: 0.1mm(4mil)min.line width/space: 0.075/0.075(3mil/3mil)special:blind&;burried+
Car Board

I take charge of the specialized production high precise printed wiring board, has 20 year printed wiring board production experience, can provide the fine product and the customer satisfactory service for the customer.
production layer: 2~20, production thickness: 0.2MM~3.2MM, smallest aperture: 0.2MM, surface treatment: The gold-plating, sinks the gold, to sink the tin, to spurt tin + Jin Shou
6layers pcb (MB--64)

material: fr4
layer coverage:6layer
thickness:1.6mm
surface finish:osp/entek
line width/space:4.6mil/6.6mil
solder mask colour:green
our factory mainly produce the pcb in shajing town baoan DIST.shenzhen city P.R.China.we can produce the double sided pcb.multilay board.FPC.lumileds board and high density interconnecting.and the surface handly have Immersion silver/au/ni/cu.and lead free HAS
mobile phone board (NOKIA6653)

Product Name: Printed Circuit Board (PCB)
Place of Origin: China
Specifications:
1) Material: FR-4, 1.6mm
2) Surface finish: HAL and Gold finger
3) Solder mask: photo imageable
4) Profile: routered
5) Min. hole diameter: 0.3mm
6) Min. line width/space: 6mils
computer board

pls see the above specfication: laminate: FR4 cem-3 layers: eight-layers surface processing: HASL+golden fingures ink colour:red the smallest hole: 0.25mm min. width&line spacing: 0.1/0.1mm out-lay tolerance:0.12MM package: vacuum in packing
pcb

pls see the below specifaction about picture:
laminate: FR-4
board thickness:1.6T/1.6mm
layers: eight-layers
min.with&line spacing: 0.1/ 0.1mm
surface processing: immersion ni/au
min.hole:0.2mm
product application: computer or communication
8 layers pcb (hp--65)

Material: FR-4
Layer Coverage: 6Layers
Thickness: 1.8mm
Surface Technique: HASL
Line Width/Space:3.2mils/3.6mils
Solder Mask Color: red
Specialty: BGA,Impedance Control and electrionics test-- open and close circuit control

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