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Shenzhen X-Mulong Circuit Co., Ltd.

8l PCB with Gold Finger

1 Number of Layers 1-30Layers
2 Finished Boards Thickness 0.2mm-6.0mm
3 Max.Panel size 610mm X 1200mm
4 Available Laminates Material FR1,FR2,CEM1,CME3,FR-4, High TG FR-4,PTFE,Aluminum Base,
1L Halogen Free PCB

NO.
Item
Parameter

1
Number of Layers
1-30Layers

2
Finished Boards Thickness
0.2mm-6.0mm

3
Max.Panel size
610mm X 1200mm

4
Available Laminates
1L PCB with OSP Surface

NO.
Item
Parameter

1
Number of Layers
1-30Layers

2
Finished Boards Thickness
0.2mm-6.0mm

3
Max.Panel size
610mm X 1200mm

4
Available Laminates
6L High Frenquency PCB

NO.
Item
Parameter

1
Number of Layers
1-30Layers

2
Finished Boards Thickness
0.2mm-6.0mm

3
Max.Panel size
610mm X 1200mm

4
Available Laminates
Flex PCB

1. Multi-layer:FPC Max Layer 8
2. Rigid-flex FPC Max Layer 16flex layer including max 6layer)
3. Panel Max. Size 18*28Inch or 10*29Inch
4. Min. Trace width& space 3.5/3.5Mil0.5OZ base copper
16l Blind And Via Holes Pcb

16layer,
406. 4*406. 4mm(1up),
FR4 material,
5. 08mm board thickness,
1oz finished copper all layers,
Impedance control,
Min hole 0. 1mm, total hole qty: 5574,
Min track/gap: 0. 135/0.
4L PCB with Leadfree

1 Number of Layers 1-30Layers
2 Finished Boards Thickness 0.2mm-6.0mm
3 Max. Panel size 610mm X 1200mm
4 Available Laminates Material FR1, FR2, CEM1, CME3, FR-4, High TG FR-4, PTFE, Aluminum
Rigid & Flex PCB

1. Multi-layer:FPC Max Layer 8
2. Rigid-flex FPC Max Layer 16flex layer including max 6layer)
3. Panel Max. Size 18*28Inch or 10*29Inch
4. Min. Trace width& space 3.5/3.5Mil0.5OZ base copper
10oz Copper PCB

Layer: 2Layer
Material: FR4
Board thickness: 2. 40mm
Copper thickness: 10oz(finished)
Min holes: 0. 3mm
Surface finished: immertion gold
6L HDI PCB

Product :6 Layer PCB 2.6mm Base Material: FR4 Surface Finish: HAL(Lead-Free) Profile :CNC Min Hole dia :0.2 mm Min Track width :0.1 mm Min Track space :0.1 mm Soldermask :Green/Green Copper thickness
24 layer PCB (4/3.5MIL)

Layer count: 24board thickness: 3. 0mmsmallest holes: 0. 20mmaspect ratio: 12: 1via holes to the inner layer track: 7. 8milTreaatment: immersion goldFinal dimension: 230*300mmTrack/gap in innerlayer:
Rigid & Flex PCB

1. Multi-layer:FPC Max Layer 8
2. Rigid-flex FPC Max Layer 16flex layer including max 6layer)
3. Panel Max. Size 18*28Inch or 10*29Inch
4. Min. Trace width& space 3.5/3.5Mil0.5OZ base copper
Heavy Copper PCB

1. Number of Layers: 1-20Layers
2. Finished Boards Thickness: 0. 2mm-6. 0mm
3. Max. Panel size: 600mm X 1200mm
4. Available Laminates Material: FR1, FR2, CEM1, CME3, FR-4, High TG FR-4,
12L PCB with 5oz heavy copper

Layer:12Layer
material:FR4
Board thickness:3.20mm
Copper thickness:5oz (inner)
copper thickness:5oz(outer)
min holes:1.0mm
Surface finished:immertion gold
1L Aluminium based PCB

number of layers : 1
material : Aluminium 1.5mm
non pth
pannel with 2 technical boarders of 8mm
Cu thickness : outerlayer 35,innerlayer 0
pcb size : 300mm x 150mm
finishing : Immertion
Multi-layer PCB(4L up to 30L)

NO.
Item
Parameter

1
Number of Layers
1-30Layers

2
Finished Boards Thickness
0.2mm-6.0mm

3
Max.Panel size
610mm X 1200mm

4
Available Laminates
8L PCB with hard gold

1 Number of Layers 1-30Layers
2 Finished Boards Thickness 0.2mm-6.0mm
3 Max.Panel size 610mm X 1200mm
4 Available Laminates Material FR1,FR2,CEM1,CME3,FR-4, High TG FR-4,PTFE,Aluminum Base,
High Dencity Interconnection(HDI) 16L PCB

FR4,16L with blind/via holes.
2.29mm,1oz inner and 1oz outer copper
min holes:0.075mm,min line width/tap:0.127mm/0.127mm
Surface finish:Immertion gold
Multi-layer PCB(10L PCB)

NO.
Item
Parameter

1
Number of Layers
1-30Layers

2
Finished Boards Thickness
0.2mm-6.0mm

3
Max.Panel size
610mm X 1200mm

4
Available Laminates

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