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FONG YONG CHEMICAL CO., LTD.

cpu heat sink thermal compound

Heat sinks compound / thermal compound is a white paste silicone product heavily filled with heat-conductive metal oxides. The incorporation of high efficient heat-conductive metal oxides promotes high thermal conductivity, low bleeding, and high-temperature stability. Up to approximately 300oC, the product is very stable to changes of temperature. It helps to maintain a positive heat sink seal th
electronic potting encapsulating compound

RTV / Heating potting / encapsulating resin / compound be used widely in Electrical and Electronic Industry -> electronic / electrical potting and encapsulating coating --> compound, insulating materialss, encapsulating coatings, casting, threat sealant, high temperature sealants, industrial sealants, filling, insulating materials, thermal insulation, impregnating for most electronic components an
doming resin - epoxy, polyurethane series

Doming resin : Epoxy, PU (Polyurethane), UV cured resin
1) Hard / Flexible / non-sage system resin
a. PU (Polyurethane) doming resin
b. Epoxy hard system doming resin
c. Epoxy flexible system doming resin
d. Epoxy non-sag system doming resin
2) High gloss clear and colors system
3) Application for decoration, Ornaments, Gifts & Souvenirs
suit for various materials such as metal

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