Member Since

2007

SAFA AND SBAIHCO.SEINYAINT TRADING

 
  • Printed Circuit Board
    Process description
    Number of layers: Four-side
    Material: FR--4
    Board thickness: 1.8mm
    Minimum via hole: 0.1mm(4mil)
    Minimum line width: 0.1mm(4mil)
    Minimum line space: 0.1mm(4mil)
    Special process: pad antioxidation
  • Printed Circuit Board
    Process description
    Number of layers: Six-side
    Material: FR--4
    Board thickness: 1.6mm
    Plating process: tin-spray+Immersion gold
    Minimum via hole: 0.15mm(6mil)
    Minimum line width: 0.15mm(6mil)
    Minimum line space: 0.15mm(6mil)
    Special process: BGL bonding pad+Gold finger
  • PCB
    Process description
    Number of layers: Four-side
    Material: FR-4
    Board thickness: 1.8mm
    Plating process: tin-spray
    Minimum via hole: 0.25mm(10mil)
    Minimum line width: 0.2mm(8mil)
    Minimum line space: 0.3mm(12mil)
    Special process: BGL bonding pad
 
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