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Consons Electronic Technologhy Ltd

~Aluminium Based Board

Product Description
Material: aluminium
Layer Coverage: 1Layers
Thickness: 1. 6 mm
Min. Line Width: 0. 1mm
Min. Line Spacing: 0. 1mm
Min. Hole DIA: 0. 2mm
Surface Technique: immersion gold
Specialty: metal based
~Flexible Printed Circuit -2

Product Description
Specification
4 l flexible board
Min. Line Width: 4 Mil
Min Lin Spacing: 4 Mil
Min Hole Diamater: 0. 3mm
Base material: polyimide
Surface treatment: tin plating
FR4 stiffener on the back of solder fingers, impedance
-Gold Plated Board

Product Description
Gold plated Board
Base Material: FR4
Layer: 6 layers
Min. Line Width/Space: 3mils/3mils(0.076mm/0.076mm)
Min. Annular Ring Width: 3mils(0. 076mm)
Min. Hole Size: 0.1mm
Min. Blind-via: 0.1mm
Min. Buried-via: 0.1mm
Min. Inner layer clearance: 0.010"
Min. Silkscreen line width: 5mil
Min. SMD spacing 3mil: 9.6
Mini. Pad diameter: 3mil
Max. Board Thickness:
*4 Layer Impedance Pcb

Product Description
Material: FR4
Layer Coverage: 4Layers
Thickness: 1. 6 mm
Min. Line Width: 0. 1mm
Min. Line Spacing: 0. 1mm
Min. Hole DIA: 0. 2mm
Surface Technique: immersion gold
Specialty: IMPEDANCE Control: 65ohm+-10%
*6 Layer Immersion Gold PCB

Material: FR-4
Layer Coverage: 6Layers
Thickness: 1. 6 mm
Min. Line Width: 0. 1mm
Min. Line Spacing: 0. 1mm
Min. Hole DIA: 0. 2mm
Surface Technique: immersion gold
Specialty: blue soldermask + gold finger
*FPC - 1

No of Layers: 1
Min Line Width: 3 mil
Min Line Spacing: 3mil
Min. Hole Diameter: 0.3mm
Copper Thickness: 18um, 35um, 50um
Material: Polyimide
Surface finish: immersion gold
*PCB Assembly -4

Pcb assembly, we can provide you the components according to your bom list.
20/15/12 Mil pitch and 0402 placement
Automated axial insertion and Automated radial insertion
Computer controlled wave soldering
Three surface mount production lines
Providing electronic components purchase service for the customers
Visual inspection, AOI, ICT inspection
*HASL Lead-free PCB

Base Material: FR4
Layer : 2 layers
Min. Line Width/Space: 3mils/3mils(0.076mm/0.076mm)
Min. Annular Ring Width: 3mils(0.076mm)
Min. Hole Size: 0.1mm
Min. Blind-via: 0.1mm
Min. Buried-via: 0.1mm
Min. Inner layer clearance: 0.010"
Min. Silkscreen line width: 5mil
Min. SMD spacing 3mil: 9.6
Mini. Pad diameter: 3mil
Max. Board Thickness: 6.0mm
Aspect Ratio≤ 10: 1
Max.

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