LISTED SINCE
6/18
Printed Circuit Board
Detailed Product Description
Process description
Number of layers: Six-side
Material: FR--4
Board thickness: 1.6mm
Plating process: tin-spray+Immersion gold
Minimum via hole: 0.15mm(6mil)
Minimum line width: 0.15mm(6mil)
Minimum line space: 0.15mm(6mil)
Special process: BGL bonding pad+Gold finger
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