LISTED SINCE
6/18
PCB
Detailed Product Description
Process description
Number of layers: ten-side
Material: FR4 High TG
Board thickness: 1.6mm
Plating process: Chemical nickel gold
Minimum via hole: 0.15mm(6mil)
Minimum line width: 0.1mm(4mil)
Minimum line space: 0.1mm(4mil)
Special process: buried blind via hole
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