cpu heat sink thermal compound

Heat sinks compound / thermal compound is a white paste silicone product heavily filled with heat-conductive metal oxides. The incorporation of high efficient heat-conductive metal oxides promotes high thermal conductivity, low bleeding, and high-temperature stability. Up to approximately 300oC, the product is very stable to changes of temperature. It helps to maintain a positive heat sink seal that improves heat transfer from the electrical / electronic devices to the heat sink or chassis, thereby increasing overall efficiency of the devices.

Place of Origin:	Taiwan
Model No:	cpu heatsink thermal compound
Brand Name:	FONG YONG