Encapsulating Machine (J20145)

* This machine is operated on touch panel human-machine interface automatically controlled by PLC. Multiple servo system combined with multiple sensors automatically send the cards and modules, and the parameter is adjustable which ensures high speed and high precision working of the machine. Stepping cylinder conveys the module tape, module tape correct the punching position automatically which ensures the module punching accuracy.

* Feature:

1) It incorporates IC module punching and conveying, hot welding, cold welding and encapsulating, IC module testing.

2) Hot welding first and then cold welding, encapsulating temperature is adjustable.

3) Repeated hot welding ensures better effect.

4) Special cooling system for hot welding which enables it applicable.

5) To various heat-melting glue for chip implanting.

6) Automatic correction of module position, with high precision.

7) Automatic identification and rejection of poor modules.

8) Automatic monitoring and protection for module stepping.

9) Belt conveying structure ensures high speed and stable work.

10) Rational card correcting structure guarantees high precision of encapsulating.