Shenzhen Kaizhitong Microelectronics Technology Co., Ltd.| Manufacturer

Shenzhen Kaizhitong Microelectronics Technology Co., Ltd.

[ Guangdong, China ]
Business Type: Manufacturer
Brand(s): KZT
Main Markets: North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Main Product: Ic Test Socket, Burn in Socket, Programming Socket, EMMC Socket, EMCP Socket, BGA Socket, LGA Socket, Sop TSOP Socket
Year Established: 2000
Factory Location: Shenzhen, Guangdong, China
Years OEM Experience: 15
Production Line Count: 5
Ownership Type: Individual (Sole proprietorship)
Employ Number: 101 - 500 People
Annual Sales Volume: Below US$1 Million
Registered Capital: US$501 Thousand - US$1 Million
Export Percentage: 21% - 30%
Factory Size: Below 1,000 square meters
QA/QC: In House
Number of R&D Staff: 5 - 10 People
Number of QC Staff: 5 - 10 People
  • Onsite operations checked and legal status confirmed
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Shenzhen Kaizhitong Microelectronics Technology Co., Ltd.

China Manufacturer with main products: Ic Test Socket, Burn in Socket, Programming Socket, EMMC Socket, EMCP Socket, BGA Socket, LGA Socket, Sop TSOP Socket

Home  >Products Catalog > iPad iPhone4 iNAND LGA52/60 NAND flash memory chip test socket changing iphone serial number

iPad iPhone4 iNAND LGA52/60 NAND flash memory chip test socket changing iphone serial number

FOB Price: 99.00 USD/Piece
Supply Ability: 1,000 Piece/Pieces per Week
Payment Terms: T/T, Western Union, MoneyGram
In Stock
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Export Markets: North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Place of Origin: Guangdong in China

Quick Details

  • Application: Industrial
  • Grounding: Standard Grounding
  • Type: Plug with Socket
  • Model Number: LGA52 LGA60
  • Brand Name: ANDK

Specifications

1. Pogo Pin Solution: beryllium cuprum(standard).

2. Special probe head can stab the oxidation layer of the solder, assuring stable contact and not damaging the solder ball  

3. Adopting Torlon As The Insulation Material. Engineering Material.

4. Compatible With LGA60, LGA52,IC Size:14*18mm  12*18mm.

5. Accurate Positioning On Test Pad or Solder Ball.

6. Long Life Usage(50,000 times), High Quality and Stable Performance.

7. Pressure Ajustable Design So As To Compatible With IC Thickness From 0.8-1.5mm.

8.Compatible With Samsung,Hynix,Sandisk,Toshiba,Intel,etc iNAND chip.

9: Feature: Manual Clamshell, easy to operate.

 

We're the original manufaturer , we can provide the lowest and competitive price , the shortest processing time is guaranteed . If you want batch purchase , please contact us , we can give you a discount ! 

Service Process

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