-Gold Plated Board

Detailed Product Description

Product Description
Gold plated Board
Base Material: FR4
Layer: 6 layers
Min. Line Width/Space: 3mils/3mils(0.076mm/0.076mm)
Min. Annular Ring Width: 3mils(0. 076mm)
Min. Hole Size: 0.1mm
Min. Blind-via: 0.1mm
Min. Buried-via: 0.1mm
Min. Inner layer clearance: 0.010"
Min. Silkscreen line width: 5mil
Min. SMD spacing 3mil: 9.6
Mini. Pad diameter: 3mil
Max. Board Thickness: 6.0mm
Aspect Ratio≤ 10: 1
Max. Board Size: Double size: 600*900mm, Multilayers 500*800mm
Surface Technique: Immersion gold, HASL, HASL Lead-free, Immertion Tin, Electrolytic Ni/Au, Gold finger, OSP
Finished copper weight from 0.5oz to 4oz