HDI PCB
HDI PCB products from over 43 HDI PCB manufacturers, exporters, suppliers and HDI PCB wholesalers products directory.
-
4-Layer Hdi Microvias Pcb
Flash gold (Electrolytic), Hard gold plating,
Electroless nickel Immersion gold (Electroless Ni/Au),
Organic Solderability Pr 
-
HDI Immersion Gold PCB (08030408)
* 12 layer PCB* Material:FR-4=1.6mm* Solder mask:Green* Silk Screen:White* Finish:Immersion gold* Base Copper Thickness: 1 oz. To 2 oz. * 1 Board Thickness: typically.575mm* PTH Hole Tolerance: Plus
-
16l Blind And Via Holes Pcb
16layer,
406. 4*406. 4mm(1up),
FR4 material,
5. 08mm board thickness,
1oz finished copper all layers,
Impedance control,
Min hole 0. 1mm, total hole qty: 5574,
Min track/gap: 0. 135/0.
-
18 Layers HDI PCB
Product Description Layer NO: 18 layers rigid PCB material: FR4 + high Tg: 170 (s1170) finished thickness: 1.6 mm +/- 0.16mm siz
-
HDI PCB
1.Single-sided, double-sided and multilayer boards 2.CEM-1, FR-4, FR-4 TG 170, Aluminum base material 3.HAL, HAL lead free, Imme
-
Printed Circuit Board (4 Layer HDI PCB)
4 layer HDI PCB(1+C+1/2+C+2)Number of Layers: 4-Layer Copper Thickness: 1OZ Min. Line Width: O,1MM Min. Hole Size: O.1MM Board Thickness: 1.0MM Base Material: FR4 Min. Line Spacing: 0.1MM
-
mobile phone board/Multilayer board/HDI PCB
Technologies Requirement: Layer: 8 layers Material: FR-4 Thinkness: 1.0mm/1.0T Finish: Immersion NI/AU
Solder Mask: GreenMIN. Hole size: 0.1mm(4mil) Min. Line width/space: 0.075/0.075(3mil/3mil)
-
PCB
Quick turn prototype and Small volume Printed Circuit Board *Double sided up to 16 layer pcb *Blind and Buried via PCB *High fre
-
4L HDI PCB
4L HDI PCB for Mobile Phone Touch Pad with ENIG Finish
Number of layers: 2 to 16 layers rigid multilayer PCB
Maximum board s
-
Multilayer HDI (JXPCB-01)
Base material:rogers
layers:26
Min line width/gap:305mil
Cu thickness:5oz(inner)/7oz(exterior)
Blind &buried hole
-
-
HDI high difficulty 10 layer pcb
Material:FR-4+RCC Finish thickness: 1.6mm Surface processing:immersion gold Copper thickness:1oZ Laser drill hole(Min.):0.1mm Min. line space: 0.13m Min. line width: 0.1mm
-
Eight Layers HDI PCB
Eight layers HDI PCB
Board thickness:1.0±0.1mm
Micro via:100um
Line/Space :4/4mil
Surface finish :ENIG
Material :Halogen- free
Rohs compliance
-
HDI PCB
Board Type:HDI PCB/ HDI PWB/ Rigid PCB1)Structure
1+C+1/2+C+22)Matreial
FR4/HighTG FR43)Copper thickness
max 1oz4)Dielectric thickness
max 3mil5)Pattern Width/Space
max
-
Copper Filled HDI PCB with ENIG and OSP Finish, Made of EM22B
Copper filling HDI Ⅲ
Internal number: 08HH003
Plating: copper filling
Board thickness: 0.85 ± 0.1mm
Dimple: ＜10 um
Registration to layer: ＜50 um
Line/space: 4/4 mil
Micro-via: 100um
-
PCB FPC HDI COB
mainboard PCB
-
HDI PCB used for mobile phone
High density interconnects (HDI) are defined as substrates or boards with a higher wiring density per unit area than conventional printed circuit boards (PCB). They have finer lines and spaces (<75 um...
-
6 layers HDI PCB
6 layers HDI PCB; Materials: FR-4; Finished Thickness:1.6mm(+/-10%); Surface finishing: Immersion Gold; Copper thickness: 1OZ
-
printed circuit board
Genma is an innovative service provider to the electronics industry, manufacturing high quality lead free PCB and PCBA as per WEEE & RoHs directives. The products include flexible printed circuit...
-
HDI PCB (Printed Circuit Board)
Layer:8L
Material:FR4,1.2mm
Character:Laser drilling,blind & buried hole,0.1mm min hole size
Min trace width/space:3/3mil
Surface finished:Immersion gold
Application:mainboard for mobile
-
HDI PCB
Maxmum 10 layers HDI, Blind(0.1mm) and Buried(0.2mm) Via.line width/spacing:0.12/0.12mm.Aspect ratio 6:1