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Electrolysis Copper Foil (1)
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2007
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Jiehang Electronics Co. Ltd
Electrolysis Copper Foil (1)
Electrolysis Copper Foil (1)
Detailed Product Description
This product is produced according to IPC-CF-105E, GB/T5230-1995 and IEC standards. Through a variety of surface treatments, its features are high bonding-strength with base board, high-temperature oxidation resistance, uniform thickness and no pinhole. This electrolysis copper foil is purposely for CCL and PCB with thickness of 18μm, 35μm and 70μm.
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