Number of Layers 2layer 4layer-10layer
Copper Thickness 0.5-10 oz 0.5-10 oz
Base Board Thickness 0.2-4.0 mm 0.4-5.2 mm
Incombustibility 94V - 0 94V - 0
Peelable resistance 12.3N/cm 12.3N/cm
Twist 0.5% 0.5%
Insulation resistance 10(11) 10(11)
Test voltage 100DCV 100-200DCV
Finished board area 560*610mm 560*610mm
Min. Line Width and Spacing 0.1/0.1mm 0.1/0.1mm
Copper thickness in hole 25.0um 25.0um
Mini. pad diameter Inner layer 0.5mm
Out layer 0.076mm 0.076mm
Mini. Hole Diameter 0.25mm 0.20mm
Hole tolerance PTH ?.076mm ?.076mm
NPTH ?.05mm ?.05mm
Hole location tolerance ?.076mm ?.05mm
profile tolerance CNC Routing ?.01mm ?.01mm
Punching ?.013mm ?.013mm
Solder mask bridge ability 0.1mm 0.1mm
Solder mask rigidity 6H 6H
Solderable test 245C 5second
Thermal cycling ability 288C 10second
Surface Finishing OSP,HAL,Immersion AU,Soft Au Plating,Gold Finger
Qaulity standard IPC-A-600F,IPC-ML-950