PCB/FPC

PRODUCTS
Single-sided
Double-sided
Multilayer up to 24 layers
Flex
Rigid-flex
Microvia with blind/buried vias
High frequency/speed
High temperature
Metal core
Lead free
Halogen free
MATERIALS
CEM-1, CEM-3
FR-4
High Tg FR-4
High speed / High frequency
Halogen-free laminate
Metal Core
Polyimide
Polyester
TECHNOLOGIES
Laser drilling
Blind /Buried via
Via plugging
Slot cutting
Controlled impedance
Liquid photo-imageable solder mask (LPI)
Heavy copper
Mix material
SURFACE FINISHINGS
HAL (hot air levelling)
Lead free HAL (lead free hot air levelling)
OSP (organic solderability preservatives)
Electroless immersion tin
Electroless immersion nickel/gold
Electrolytic flash gold
Selective nickel/gold
Conductive carbon ink
Gold tab/finger
Peelable solder mask