Mobile HDI PCB

Material/thickness: 8 layers HDI PCB Line Width/space: 0.1 /0.1mm Treatment: Nickel/Gold Country of Origin: China High density interconnects (HDI) are defined as substrates or boards with a higher wiring density per unit area than conventional printed circuit boards (PCB). They have finer lines and spaces (<75 um), smaller vias (<150 um) and capture pads (<400 um), and higher connection pad density (>20 pads/cm2) than employed in conventional PCB technology. HDI is used to reduce size and weight, as well as to enhance electrical performance. In addition to HDI, terms such as "build-up board" in Japan and "sequential build-up (SBU)" or "microvia technology" in the U.S. can be used interchangeably.

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