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Gold
3rd year

Shenzhen HTWY Technology Co., Ltd.

City : Shenzhen

Province/State : Guangdong

Country/Region : China

Telephone: 86-0755-26738518

 

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Detailed Product Description

four layer BGA gold finger PCB
Material:FR-4=1.6mm
Solder mask:Green
Silk Screen:White
Finish:Immersion gold
Base Copper Thickness: 1 oz. To 2 oz.
1 Board Thickness: typically.575mm
PTH Hole Tolerance: Plus or Minus 0.05mm
Min Mechanical Hole: 0.2mm
Min Laser Drill Hole: 0.075mm
Minimum Line Width: 0.1mm
Minimum Line Spacing: 0.1mm
Surface Finishing: HASL; HAL; Immersion Gold/Tin/Silver; flash gold
Minimum SMT Pitch: 0.40mm
Electrical Testing: Voltage: 24V - 400V
Twist and Warp: Less than 1%
BGA Pitch: .006"
Rohs compliance
Post Date:5/20/2008
Expiry Date:8/18/2008

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