we can supply the mobile phone board/HDI

Detailed Product Description

Technologies Requirement:
layer: 8 layers
Material: FR-4
Thinkness: 1.0mm/1.0T
Finish: Immersion NI/AU
MIN.Hole size: 0.1mm(4mil)
min.line width/space: 0.075/0.075(3mil/3mil)
special:blind&burried+ impedance control
packing: packing in vaccum

FOB Price:	USD2-3shanghai
Other Price Terms:	FOBshanghai or hongkong

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we can supply the mobile phone board/HDI

Detailed Product Description

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