1) material: FR-4, FR-1, CEM-1, CEM-3, FR-4 Halogen Free
2) layer: 1-12
3) board thickness: 0.4mm-3.2mm
4) copper thickness: 0.5oz, 1.0oz, 2oz, 3oz,
5) min.drilled hole size: 0.2mm
6) min.track width/space: 4/4mil(0.1/0.1mm)
7) surface finish: HASL, Lead free HASL, OSP, Gold-plating, Chemical silver, Chemical gold(ENIG), Chemical tin, Carbon ink,
8) solder mask color: green, yellow, black, white, red, blue
9) profiling: Punching, Routing, V-cut, Golden finger, Beveling
10) V-cut angle: 20°，25°，30°，45°，
11) Beveling angle: 20°，25°，30°，45°
12) Max working panel: 24*20 (610mm*508mm)
13) E-test voltage: 50-300V
14) Certificate：UL, ISO9001, ISO14001, ISO/TS 16949, RoHS
15) Impedance control:
Microstrip impedance: 50-60Ω，Tolerance: ±10%
Differential Impedance: 90-120Ω, Tolerance: ±10%
16) Quality standard: IPC-A-600F