PCB

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  PCB 11/19/2007

  Process description
  Number of layers: ten-side
  Material: FR4 High TG
  Board thickness: 1.6mm
  Plating process: Chemical nickel gold
  Minimum via hole: 0.15mm(6mil)
  Minimum line width: 0.1mm(4mil...

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  PCB 11/19/2007

  Process description
  Number of layers: six-side
  Material: FR4 High TG
  Board thickness: 1.6mm
  Plating process: gold plating
  Minimum via hole: 0.2mm(8mil)
  Minimum line width: 0.127mm(5mil)
  Minimum...

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  PCB 11/19/2007

  Process description
  Number of layers: double-side
  Material: FR--4
  Board thickness: 0.8mm
  Plating process: gold plating
  Minimum via hole: 0.3mm(12mil)
  Minimum line width: 0.25mm(12mil)
  Minimum...

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  PCB 11/19/2007

  Process description
  Number of layers: Six-side
  Material: FR--4
  Board thickness: 2.0mm
  Plating process: tin-spray
  Minimum via hole: 0.2mm(8mil)
  Minimum line width: 0.2mm(8mil)
  Minimum line space:...

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  PCB 11/19/2007

  Process description
  Number of layers: Four-side
  Material: FR-4
  Board thickness: 1.8mm
  Plating process: tin-spray
  Minimum via hole: 0.25mm(10mil)
  Minimum line width: 0.2mm(8mil)
  Minimum line...

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  Printed Circuit Board 11/19/2007

  Process description
  Number of layers: Six-side
  Material: FR--4
  Board thickness: 1.6mm
  Plating process: tin-spray+Immersion gold
  Minimum via hole: 0.15mm(6mil)
  Minimum line width: 0.15mm(6mil...

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  Printed Circuit Board 11/19/2007

  Process description
  Number of layers: Four-side
  Material: FR--4
  Board thickness: 1.8mm
  Minimum via hole: 0.1mm(4mil)
  Minimum line width: 0.1mm(4mil)
  Minimum line space: 0.1mm(4mil)
  Special...

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  PCB 10/25/2007

  Process description
  Number of layers: Eight-side
  Material: FR4
  Board thickness: 1.0mm
  Plating process: tin-spray+Chemical nickel gold
  Minimum via hole: 0.15mm(6mil)
  Minimum line width: 0.1mm...

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  PCB 10/24/2007

  Process description
  Number of layers: Four-side
  Material: FR--4
  Board thickness: 1.2mm
  Plating process: tin-spray+Immersion gold
  Minimum via hole: 0.15mm(6mil)
  Minimum line width: 0.15mm(6mil...

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  pcb 10/24/2007

  Process description
  Number of layers: double-side
  Material: FR-4
  Board thickness: 2.0mm
  Minimum via hole: 0.5mm
  Special process: oxidation resistance

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  pcb 10/24/2007

  Process description
  Number of layers: Four-side
  Material: FR-4
  Board thickness: 1.8mm
  Plating process: tin-spray
  Minimum via hole: 0.25mm(10mil)
  Minimum line width: 0.2mm(8mil)
  Minimum line...