PCB 11/19/2007
Process descriptionNumber of layers: Six-sideMaterial: FR--4Board thickness: 2.0mmPlating process: tin-sprayMinimum via hole: 0.2mm(8mil)Minimum line width: 0.2mm(8mil)Minimum line space:...
Process descriptionNumber of layers: ten-sideMaterial: FR4 High TGBoard thickness: 1.6mmPlating process: Chemical nickel goldMinimum via hole: 0.15mm(6mil)Minimum line width: 0.1mm(4mil...
Process descriptionNumber of layers: six-sideMaterial: FR4 High TGBoard thickness: 1.6mmPlating process: gold platingMinimum via hole: 0.2mm(8mil)Minimum line width: 0.127mm(5mil)Minimum...
Process descriptionNumber of layers: double-sideMaterial: FR--4Board thickness: 0.8mmPlating process: gold platingMinimum via hole: 0.3mm(12mil)Minimum line width: 0.25mm(12mil)Minimum...
pcb 10/24/2007
Process descriptionNumber of layers: Four-sideMaterial: FR-4Board thickness: 1.8mmPlating process: tin-sprayMinimum via hole: 0.25mm(10mil)Minimum line width: 0.2mm(8mil)Minimum line...
Process descriptionNumber of layers: double-sideMaterial: FR-4Board thickness: 2.0mmMinimum via hole: 0.5mmSpecial process: oxidation resistance
PCB 10/24/2007
Process descriptionNumber of layers: Four-sideMaterial: FR--4Board thickness: 1.2mmPlating process: tin-spray+Immersion goldMinimum via hole: 0.15mm(6mil)Minimum line width: 0.15mm(6mil...
Printed Circuit Board 11/19/2007
Process descriptionNumber of layers: Six-sideMaterial: FR--4Board thickness: 1.6mmPlating process: tin-spray+Immersion goldMinimum via hole: 0.15mm(6mil)Minimum line width: 0.15mm(6mil...
Process descriptionNumber of layers: Four-sideMaterial: FR--4Board thickness: 1.8mmMinimum via hole: 0.1mm(4mil)Minimum line width: 0.1mm(4mil)Minimum line space: 0.1mm(4mil)Special...
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