PCB

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  • Printed Circuit Board

    Printed Circuit Board

    Process description
    Number of layers: Four-side
    Material: FR--4
    Board thickness: 1.8mm
    Minimum via hole: 0.1mm(4mil)
    Minimum line width: 0.1mm(4mil)
    Minimum line space: 0.1mm(4mil)
    Special...
  • Printed Circuit Board

    Printed Circuit Board

    Process description
    Number of layers: Six-side
    Material: FR--4
    Board thickness: 1.6mm
    Plating process: tin-spray+Immersion gold
    Minimum via hole: 0.15mm(6mil)
    Minimum line width: 0.15mm(6mil...
  • PCB

    PCB

    Process description
    Number of layers: Four-side
    Material: FR-4
    Board thickness: 1.8mm
    Plating process: tin-spray
    Minimum via hole: 0.25mm(10mil)
    Minimum line width: 0.2mm(8mil)
    Minimum line...
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