Place of Origin: | Shenzhen in China |
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Packaging Details: | Vacuum Packaging with Desiccant |
Specifications
Board Type: Multilayer PCB/PWB/Rigid PCB | |
1)Matreial | FR4/ HighTG FR4/ Halogen Free FR4/ PTFE/ FR4+Rogers |
2)Layers | max 26 |
3)Copper Thickness | max 6oz |
4)Board Thickness | max 5. 0mm |
5)Pattern Width/Space | min 3/3mil |
6)Hole Size | min 6mil |
7)Characterestic Impedance | 10% |
8)Drill Hole | Buried/Blind/Through via |
9)Solder Mask | Green/ Blue/ White/ Red |
10)Surface Finish | HASL/LF HASL/ENIG/Gold Finger/Gold Plating |
Immersion Tin/Immersion Silver/OSP | |
11)Certificate | UL 94 V-0/ROHS |
12)Application Area | Mobile Phone/Substrate Board/Computer/Note Book |
Automobile/Medical/DVC/DC/others | |
13)Production | Pilot/Prototype/Mass Production |
Samples/Quick Turn | |
High Mixture Low Volume(HMLV) |