Meizhou China Unite Elctronics Co., Ltd.| Manufacturer
Meizhou China Unite Elctronics Co., Ltd.

China Manufacturer with main products: PCB, PCB Board, Print Circuit Board, Double Side Pcb, Multilayer PCB, 2 Layer PCB, PCBA, Rigid PCB

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Mutilayer PCB

FOB Price: 2.00 - 10.00 USD/Piece
Supply Ability: 30,000 Square Meter per Month
Shipping: 15days after received your payment
Payment Terms: L/C, T/T(Bank Transfer)
In Stock
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Place of Origin: Guangdong in China
Packaging Details: PCB must be cleaned and dried to insure storage for 180 days in the unit package without corrosion,

Specifications

SPECIFICATION OF PCB
Country of Origin:China (mainland)
Vendor to be UL recognized to minimum category of 94V0
Fabricated in accordance with IPC-A-600,latest version unless otherwise specified in attached specification.
All patterns according to Customer PCB Artwork/Film/Gerber File.
Material:FR-4 other
We would provide a copy of UL materials certificate.
This is a    Single Layer   Double Layer  4Layer   Other
Weight of Copper:   1 oz per sq .ft(Base Material)for Outer Layers. Finish to be 2oz per sq.ft oz per sq.ft(Base Material)for Inner Layers.
Finished Board thickness shall be(Tolerance is ±10%):0.8mm  1.0mm   1.2mm  1.6mm   Other
Finishing according to IPC-TM-650(2.2.13)latest version.
Via Method:   PTH   NPTH   Blind Via between layer
PCB must be identified with MFR’S approval logo, type designation week and year(WWYY) OF MFR and Customer P/
MFR’s UL Logo&indicated location According to PCB Drawing of Gerber data
Date code location: Print on Top/Bottom Side Silkscreen Layer
Etch on Top/Bottom Side Copper Layer.
Customer Part No.&Silkscreen Layers  According to PCB Drawing or Gerber data indicated location.
All PCB will be electrical tested before shipment
Other Test and Reliability standard refer to IPC-A-600(latest version)PCB Class1  Class2  Class 3
As per ion-contamination test results.(IPC-TM-650 Test Method2.3.25)
Finishing:  HAL   ENTEK  Pre-flux  Gold Flash  Gold Plating  Immersion Tin               Immersion Silver   Immersion gold
Min. hole size: 12mil or mm(Remark: The minimum hole size are for drill bit size)
Legend Silkscreen: Top or Bottom side
Legend marking do not allow printed on soldering pad and must keep clearance 10 mil min,leave to the soldering pad
Silkscreen color: White   Yellow  Black 
We will provide specification & Materail Safety Data Sheet(MSDS) of legend ink
Soldermask: Wet film  Dry film  Conventional   Peelable
Plug all via holes by soldermask on Top Side or Bottom Side
Soldermask color:  Green   Blue   Yellow   Red    Other
Fabrication:  Routing   Punching  Handmade  
All sample board and risk buy order will be acceptable for routing
PCB Unit/Panel size:163.3X215.6inch/mm
Comply RoHS standard
Packing: PCB must be cleaned and dried to insure storage for 180 days in the unit package without corrosion, visible fingerprints, oxidation, mold or loss of solder ability. All boards shall be packaged in such a manner as to prevent board-to-board damage and/or damage from external cause. Paper interleaving is preferred, and if used, must be free of sulfites and other materials which will contaminate the board surface.
Pattern Comparison :All patterns according to PCB Artwork/Film/Gerber File.
Trace & Space Width Within ±20% per artwork.
Conductor Nicks, scratches or pinholes < 20% of nominal width
Pads :Nicks, scratches or pinholes < 20% of nominal width No lifted or damaged pad No dewetting, excessive solder or exposed copper for HAL .No decoloration, oxidation or exposed base metal for Au No scratch or exposed copper for carbon .Holes No block hole or extra hole on board No crack or excessive solder inside hole for PTH Annual ring, 0.1mm Min. for component hole and 0.05mm Min. for via hole No plating on Non-PTH wall
Solder Mask ,No scratch, conductor exposed or foreign matter under solder mask.Solder mask on edges of non-soldering pads remains 80% of pad area.Solder mask on edges of soldering pad remains 80% of pad area for silk-screen method.No solder mask on all soldering pads for wet film method.No solder mask on all soldering pads except pad edges for all methods.Qualified and confirmed to requirement of IPC-SM-840, Class 2.Minimum thickness should be 0.0004 In. (0.01mm).
Legend No illegible marking, mis-alignment or missing/extra marking No on pad except PTH Registration must be within 0.010 In. (0.25mm) of the silkscreen master pattern.Epoxy ink must be nonflammable,non-conductive, non-hydroscopic and able to withstand the wave soldering or SMT reflow soldering and post cleaning operation. Contact Finger No defect found on the central portion of the 80% finger area No Solder and Soldermask allowed on Contact Finger. Not allow exposing Nickel or Copper Base Material on Contact Finger.
Electrical Test :No open/short circuits (Must be test in PP samples)
All conductor paths must be tested for continuity and for shorts to all other
conductors.The nets must be tested continuity at the plated through hole or surface mount pads.The maximum resistance must be 10 ohms or less.The minimum resistance must be 1M ohms at 100VDC or 2M ohms at 250VDC.
E-test Mark Must be present after Electrical Test.
 
Hole Sizes :Guide Holes -Measuring all, all according to Fab Dwg.
PTH -Sampling at least 10 of evenly distributed holes of each hole size, all
according to Gerber file or hole charts.NPTH -For punch holes, the tolerance ±0.1mm. For drill holes, the tolerance ±0.05mm.
Outline Dimensions: All dimensions according to Fab Dwg
Guide Holes Locations: All guide holes locations according to Fab Dwg
Board Edge Finish: Routing – All board edges must have a 125 RMS finish or batter. Copper is not allow on board periphery except at contact area of bevel. Punching – All board edges must have a finish clean and free of debris. Copper is not allowed on PCB periphery.
Board Thickness: All thickness according to Fab Dwg.
V-Cut: Distance of 2 V-Cut tips along H-plane of PCB <= 0.1mm Distance of 2 V-Cut tips along V-plane of PCB <= 1/3 T, where T = thickness of PCB, unless otherwise specified by Fab Drawing
Bow and Twist: Placing both sides in a flat surface, the highest point of both sides to the diagonal length < 1% for non-SMT and < 0.75% for SMT PCBs.
Conductor Thickness Evaluation (Micro section  or Radioactive Equipment): PTH wall and trace Cu finishing thickness > 0.025mm Pb/Sn thickness > 0.002mm (HAL) Au thickness > 0.076μm (Au PCB) > 0.76μm (Au finger) Ni thickness > 1.3μm (Au PCB) > 3.8μm (Au finger)
Solvent Resistance: IPC-TM-650 (2.3.23)  No attack
Abrasion of  Solder mask: IPC-TM-650 (2.4.27)   Over 6H
Abrasion of  Solder mask: IPC-TM-650 (2.4.28)   No peel off
Adhesion of Silk-screen: IPC-TM-650 (2.4.1)  No peel off
Solder ability: ANSI/J-STD-003    100% for Non-SMT, 95% for SMT
Thermal Stress: IPC-TM-650 (2.6.8)   No crack and delamination
Current Carrying Capacity: IPC-TM-650 (2.2.13)  2A min. for 3 minutes
Pull Strength of Conductor: IPC-TM-650 (2.4.8)   => 1.25 kg/cm2 width
Pull Strength of PTH : IPC-TM-650 (2.2.13)   => 140 kg/cm2
Payment Terms: T/T  or  L/C
30% Deposit and 70% before Delivery
Minimum Order: 1,0 to 1,000 Pieces
FOB Port: Shenzhen or HK
Lead Time: 20 - 25 days
 
 

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