Shenzhen SUNSOM Automation Equipment Co., Ltd.
China Manufacturer with main products: TAB Bonding Machine, COG Bonding Machine, Polarizer Laminator and Polarizer Delaminator, Polarizer Claving Machine, FOG Bonding Machine, ITO... |
Place of Origin: | Guangdong in China |
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Specifications
XCH53-A1
FOG Bonding M/C
Application:
The machine is used for bonding FPC, FFC, COF, TAB, HSC to various LCD panels and PCB.
●Aligning and pre-bonding ●Pre-bonding and main bonding
Technic Application: ◆ TAB ◆FOB ◆ FOG
◆Key Feature:
A. High precise long-length cylinder of bond head can solve the contradiction of cylinder distance, precision and safety.
B. Two groups three-axis micrometer adjust fixture and position accurately.
C. High precision micrometer adjusting structure and CCD camera bottom alignment, applied to various high precision ITO imaging and position.
D. The equipment body is made of good quality steel and sheet metal. High firmness and stability, elegant appearance.
E. Japanese Yamatake digital indicator, build-in PID self-tunning module.
◆Basic Parameter
Voltage:AC220V 50-60HZ
Rating Power:0.75KW
Pressure:0.4-0.8Mpa
Operation Mode:Keyboard
Work Mode:Single station fixed work
Fixture:Micrometer adjust X-Y-θ axis
Rolling Mode:Manual
Program Control:Relay
Bond Head:60mm(Customization)
Vision system:Two C/L CCD
Heat Mode:Constant Heat
Thermocouple:K type
Weight:120KG
Dimension:L730 x W535 x H1270mm
◆Front View and Side View
★ Machine parameter and specification made to customer request★
FOG Bonder from this supplier
FOB Price: 1,500.00-5,000.00 USD/Set
Min Order: 1 Set
Min Order: 1 Set
Min Order: 1 Set
Min Order: 1 Piece
More products from other suppliers
FOB Price: 45.00-55.00 USD/Chain
Min Order: 4 Chains
Min Order: 1 Set
Min Order: 1 Set
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