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Henan Tingyu International Co., Ltd.

China Manufacturer with main products: Fine Chemical, Organic Intermediates, Free Radical, Fibre Activator

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NC - 3000 series biphenyl structured epoxy resin


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Specifications

NC - 3000 series biphenyl structured epoxy resin 
This kind of epoxy resin is through phenolic type epoxy resin with biphenyl compounds, through condensation structure and the generated high heat resistant epoxy resin. Its molecular structure as illustrated
 
NC - 3000 series of biphenyl type epoxy resin products, including three varieties: standard (NC - 3000 - H), low melt viscosity type (NC - 3000), high softening point type (NC - 3000 - H), low melt viscosity model (CER - 3000 - L). They constitute condensate’s main performance table 7 shown.
 
experimental condition
Unit
NC-3000
NC-3000-H
CER-3000-L
Glass Transition Temperature
DMA
TMA
HDT
 
167
139
134
175
145
144
161
136
125
Flexural Strength
30℃
120℃
MPa
90
60
110
65
100
50
Mofulus  of  elasticity
30℃
120℃
GPa
2.6
2.0
2.7
2.1
2.4
2.8
CTE
α1
α2
Ppm
61
171
58
168
65
160
Peeling Strength  >
 
N/cm
15
17
20
Water Absorption  <
100℃/24hr
%
1.0
1.0
1.2
Water Absorption (after high temperature and high humidity)
85℃/85%/24hr
121℃/100%/24hr
 
%
0.7
1.3
0.7
1.2
0.7
1.6
KIC
 
N/㎡
26
24
23
IZCD Ballistic Test
 
 
KJ/m
17
15
18
Dielectric Constant
 
1MHz
1GHz
 
3.6
3.22
 
 
Dielectric loss Angle tangent
1MHz
1GHz
 
0.014
0.023
 
 
 
Contain biphenyl structure phenolic resin primarily chain NC - 3000 series of epoxy resin, due to its high hydrophobicity, making its  condensate hygroscopicity decline, this helps hygroscopic again after flow welding enhancement. In this containing biphenyl type epoxy resin composition structure phenolic, aromatic ring holds a large proportion, this not only make  condensate  heat resistant improved, and when burnt can form more carbonization layer, make flame retardancy can be promoted. In epoxy resins with biphenyl structure exists, make crosslinking functional groups (epoxy groups) between molecular weight increases, its one-dimenion thermal elastic modulus is low, and with high toughness characteristics. NC - 3000 series cured expoxy resin content due to high toughness features, causes it that made of PCB under high temperature lead-free soldering produces in the process of stress decreased.
 
In NC - 3000 series, more suitable for high heat resistance (adaptive free-plumburm), no halogenating FR - type 4 CCL used varieties, is the newly launched NC - 3000 - H epoxy resin. It has an average molecular weight than NC - 3000 high. Its molecular weight of the enhancement, is the benzene by adjusting the resin with methylene group combine part of benzene adjacent bits/contrapuntal (o/p) tropism acquired. NC - 3000 - H epoxy resin major difference in NC - 3000 series other two strains of performance features are: it consists of 4 1/2 curing FR slice production with resin glue and have a good solvent dissolve stability. CER - 3000 - L have low melt viscosity, more emphasis on the characteristics of the epoxy encapsulation for IC packaging material.

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