Actech Precision Ceramic (HK) Ltd.

China Manufacturer with main products: Precision Machined Ceramics, Ceramic Nozzle Tips, Ceramic Screws and Washers, Ceramics Components, Machine Ceramic Components, Ceramic Plate...

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Alumina Ceramic Substrate Laser Cutting

FOB Price: 10.00 - 50.00 USD/Piece
Supply Ability: 1,000 Piece(s) per Month
Shipping: 30days
Payment Terms: T/T
In Stock
Export Markets: North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Place of Origin: Guangdong in China
Packaging Details: According to the customer request.

Specifications

Ceramic Substrates are used in many electronic applications where a thin insulating layer of thermally
Stable material is required to conduct heat away from electronic components whilst electrically insulating
Them, and material is 92%, 96%, 99%alumina, zirconia and ZTA.
   Properties with excellent insulation, high mechanical strength, high thermal conductivity, low expansion
Coefficient, small dielectric constant, high-temperature resistance, excellent erosion and wear resistance,
Good quality in chemical shock heat and cold.
Supply alumina ceramic substrate:
Thickness: 0.3 - 2mm
Size: 10 - 300mm, According to drawing.
Laser Cutting ceramic substrate:
Cutting the highest accuracy: +/- 0.02mm
Cutting Maximum size: 152.4 x 152.4 mm
Cutting Minimum aperture diameter: 0.1mm
Cutting Maximum thickness: 1.5mm
Product Name                     
Ceramic Substrates
Material
Alumina, Zirconia and Silicon Nitride Ceramic
Color
Black and White
Size
10-300mm
Thickness 
0.3mm, 0.38mm, 0.5mm, 0.635mm,1mm, and According to drawings
Surface Roughness Ra0.2
Tolerance
+/-0.01mm
Lead time
15 - 30days                                                                                          
Max. Working 1500 -1700 °C
Samples
Avaliable
Shipping 
Air Express (DHL/UPS/TNT/ FedEx) or Ocean Shipping                       

Products Show:
Alumina Ceramic substrate laser cuttingAlumina Ceramic substrate laser cuttingAlumina Ceramic substrate laser cutting



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