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Kunshan Jilihong Technology Co., Ltd.

China Manufacturer with main products: Solder Bar, Soldering Wire, Sn60Pb40 Solder Bar/ Wire, Sn63pb37solder Bar/Wire, Solder Flux, Solder Paste, Lead-Free Solder Bar, Lead-Free...

Home  >Products Catalog > lead free solder wire > Lower temperature lead-free solder wire Sn96.5Ag3.0Cu0.5

Lower temperature lead-free solder wire Sn96.5Ag3.0Cu0.5


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Export Markets: North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Place of Origin: Zhejiang in China
Packaging Details: 10 kilograms per package in general;the box size:34.5cm*16cm*8cm

Specifications

lead-free solder wire Sn96.5Ag3.0Cu0.5:
1.suitable for the static dip soldering
2.with no clean for repairing through-hole
 

Shape & tolerance: wire
Appearance: lucent, no dirt on surface
Weight: 15KG/box or so
Features: made of pure tin and pure copper from Yunnan Tin Industry Co., Ltd., advanced processing with high purity .
Purpose: leadless soldering in high temperature for electronics industry
Physical properties:
(1) Liquid temperature: about 227
(2) Specific gravity: about 7.4
Alloy composition:(lead solder alloy)
Tin (Sn)
Cuprum (Cu)
Plumbum (Pb)
Stibium (Sb)
Bismuth (Bi)
Zincum (Zn)
Ferrum (Fe)
Aluminum (Al)
Arsenic (As)
Cadmium (Cd)
99.3 0.7±0.2 <0.1 <0.02 <0.01 <0.02 <0.02 <0.02 <0.03 <0.02
Physical properties
Spec.(colophony content) Melting point Specific gravity (g/cm2)
1.1%                                       227                     7.38
2.2%                                       227                      7.34
3.3%                                       227                      7.40 


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