| Export Markets: | North America, South America, Eastern Europe, Oceania, Western Europe |
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Specifications
1.Lead free HASL PCB with Competitive price.
2.Rosh compliant.
3.Quick leadtime.
4.No MOQ request.
5.Final functional test.
Blank PCB manufacturing capability:
| tem | Type | Standard capability |
| 1 | PCB layer | 1-6layer |
| 2 | PCB process | HASL,Flash gold,Immersion gold |
| 3 | Material | Fr4,CEM-1,MCPCB |
| 4 | copper foil | 0.5oz-5oz |
| 5 | board thickness | 0.3mm-3.8mm |
| 6 | Max work size | 480mmx600mm |
| 7 | Min work size | 20mmx20mm |
| 8 | Min hole size | 0.3mm |
| 9 | Min PTH hole | 0.5mm |
| 10 | Min line width/spacing | 0.1mm |
| 11 | Min copper foil | 350u-450u |
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Description
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Details Specification
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Base Material
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FR-4,Aluminium-backed board,Halogen-free,Lead-free compatible,High Tg,High CTI,CEM-1,CEM-3 etc.
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Mass production
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Sample
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Max Dimension
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630x530mm
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630x530mm
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Copper thickness of inner layer
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18-140um
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18-210um
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Copper thickness of outer layer
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12-210um
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12-210um
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Min.Annular ring
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0.10mm
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0.08mm
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Min.solder mask clearance
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0.05mm
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0.05mm
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Min.solder mask clearance
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0.045mm
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0.03mm
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Impedance tolerance
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±10%
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±8%
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Finished board thickness
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0.25mm-3.5mm
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0.20mm-4.0mm
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Outline precision
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±0.1mm
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±0.08mm
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Layers No.
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2-12layers
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2-14layers
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Inner layer circuit
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4/4mil
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4/3mil or 3/4mil
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Out layer circuit width/spacing
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4/4mil
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4/3mil or 3/4mil
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Board Thickness
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0.1-1.6mm
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0.075-1.6mm
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Min.drill bit size
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0.2mm
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0.15mm
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Aspect ratio
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8:01
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10:01
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Surface Finished type
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HASL,Flash golds,ENIG,OSP(lead freecompatible),Carbon ink,Peelable S/M,HASL(lead free),Immersion silver/tin,Gold finger plating,ENIG+gold finger plating,Immersion Silver+gold finger plating
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Production type
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High precision multi-layer board,Blind hole board, Buyerd hole board,High frequency board,Aluminium backed board
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Certificate
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ISO9001.UL etc
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PCB assembly Equipment:
A whole PCB assembly system= A SMD production line + A insertion production line + A hand soldering line
Quality Control:
1.Customers reconfirm the BOM list before components purchasing;
2.Ispect components when components arrived;
3.Samples confirm before mass production.
1.Customers reconfirm the BOM list before components purchasing;
2.Ispect components when components arrived;
3.Samples confirm before mass production.
4.FCT test for final assemly boards.
