MaRS Technology Corporation| Manufacturer

MaRS Technology Corporation

[ Guangdong, China ]
Business Type: Manufacturer
Brand(s): MaRS
Main Markets: North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Main Customer: opto-electronics
Main Product: GPON, GEPON, Silicon V-Groove, SERS, Raman Laser
Year Established: 2009
Factory Location: Chengdu, Sichuan Province
Production Line Count: 5
Ownership Type: Corporation/Limited Liability Company
Employ Number: 101 - 500 People
Annual Sales Volume: US$10 Million - US$50 Million
Registered Capital: US$10 Million - US$50 Million
Factory Size: 10,000-30,000 square meters
Number of R&D Staff: 31 - 40 People
  • Onsite operations checked and legal status confirmed
Ecvv Trade
MaRS Technology Corporation

China Manufacturer with main products: GPON, GEPON, Silicon V-Groove, SERS, Raman Laser

Home  >Products Catalog > Silicon V-Groove > Silicon V-Groove for PLC, AWG, WSS

Silicon V-Groove for PLC, AWG, WSS


Related products from verified members

Export Markets: North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Place of Origin: Sichuan in China
Packaging Details: standard packing

Specifications

1.  Product Description
      MaRS Silicon based V-Groove chips assist in producing high performance photonic devices. Made through high-precision silicon etching, the V-groove chip can achieve precise alignment of either ribbonized or individual fibers. The buffer area offers extra strength and rigidity to reduce breakage. Metallized chips can be welded directly with metallization fiber for non-epoxy applications.

2.  Features
Up to 32 channel V-groove arrays or customized
l  Suitable for125/250μm diameter singlemode, multimode and polarization maintaining fibers, or customized
l  Channel spacing127μm and 250μm, or customized
l  Selective surface metallization
l  Compatible with Telcordia standard
3.  Applications
l  Pigtailing of integrated optical devices
l  Connection to planar waveguide devices
l  Construction of DWD Mmultichannel devices
l  Connection and feedback for optical sensing devices
l  Attachment to an array of active devices
l  Connection of MEMS devices

4. Specifications
Part Number
Channel Number
Channel Spacing
Chip Length
Chip Width
Edge Distance
Chip Thickness
P/N
N
S(mm)
L(mm)
W(mm)
ED(mm)
T(mm)
MTT-SVG-1-250-10-2.5-1
1
N/A
10
2.5
1.250
1
MTT-SVG-2-250-8.01-2.5-1
2
250
8.01
2.5
1.075
1
MTT-SVG-4-250-8.15-2.5-1
4
250
8.15
2.5
0.875
1
MTT-SVG-8-127-10-2.8-1
8
127
10
2.8
0.955
1
MTT-SVG-8-250-8.15-3.2-1
8
250
8.15
3.2
0.725
1
MTT-SVG-16-127-12-3.2-1
16
127
12
3.2
0.647
1
MTT-SVG-32-127-12-5.7-1
32
127
12
5.7
0.881
1
MTT-SVG-64-127-12-10-1
64
127
12
10
1.000
1

 


 

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