thermally conductive silicone pad CPU thermally conductive pad silicone gap filler

Specifications

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Properties Units K300 Test Method

Construction & Composition --- Silicone & Ceramic filled ---

Color --- Light Blue Visual

Thickness Range mm 0.5~5.0 ---

Hardness Shore C 25 ASTM D2240

Density g/cc 2.7 ASTM D792

Tensile Strength KN/m 0.3 ASTM D412

Elongation % 64% ASTM D412

Continuous Use Temp C -40 to 150 EN344

Breakdown Voltage Kv/mm >=5.0 ASTM D149

Volume Impedance ohm-cm 1.1*1016 ASTM D257

Dielectric Constant 1MHz 7.15 ASTM D150

Weight Daminify --- <=0.3%  at 150C 240H

Flame Rating --- V-0 UL 94

Thermal Conductivity W/m.k 3.0 ASTM E1461

UL, RoHS, REACH --- Compliance ---

Sheet sizes:

Standard sheet size:200*400mm;Custom Die-cut parts available;Available with or without PSA on reinforced side