Hexagonal Boron Nitride Component

Specifications

Hot Pressed Boron Nitride

Hot pressed BN is compacted at temperatures up to 2000°C and pressures up to 2000 psi to form a dense,
strong engineering material that is easily machined.  It is available in standard and custom hot pressed shapes
and has several unique characteristics and physical properties which make it valuable for solving tough problems
in a wide range of industrial applications.

Thermal Management
The unique combination of excellent electrical insulation and thermal conductivity makes BN very useful as a
heat sink in high power electronic applications. Its properties compare favorably with beryllium oxide, aluminum
oxide and other electronic packaging materials, yet is easier to form and finish.
 
High Temperature Environments
Temperature stability and excellent resistance to thermal shock makes BN the material of choice in the toughest
high temperature environments such as equipment for plasma arc welding, diffusion source wafers, and
semiconductor crystal growth equipment & processing.  
  
Molten Metal Handling
BN is inorganic, inert, nonreactive with halide salts and reagents, and is not wet by most molten metals and
slags.  These characteristics, combined with low thermal expansion, make it ideal for interface materials used
in various molten metal processes.