Shenzhen Kaizhitong Microelectronics Technology Co., Ltd.

China Manufacturer with main products: Ic Test Socket, Burn in Socket, Programming Socket, EMMC Socket, EMCP Socket, BGA Socket, LGA Socket, Sop TSOP Socket

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eMMC test adapter with SD Interface, HDMI Interface bonding pads Clamshell BGA153/169 data recovery

FOB Price:	118.00 USD/Piece
Supply Ability:	1,000 Piece/Pieces per Week
Payment Terms:	T/T

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Product Details

Export Markets:	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Place of Origin:	Guangdong in China

Specifications

Features:
1. Apply to eMMC of Samsung, Sandisk, Toshiba, Hynix, Micron, HTC and Intel.
2. Apply to BGA153 and BGA169.
3. eMMC size of this product is 11.5x13mm, we also provide other sizes of 12x16mm, 12x18mm and 14x18mm.
4. Apply to eMMC thickness of 0.8 to 1.5mm.
5. With 30 pins and pin pitch 0.5mm.
6. Life cycle is around 25000 times.
7. eMMC data can be easily read and re-written.
8. Test can be done with or without solder ball.
9. Easy positioning and operation.
Only one frame guide for each fixture default, please tell us you wanted size. If need more, you should pay another $10 for per standard size plate.

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