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Hubei Huaweike Intelligent Technology Co., Ltd.
China Manufacturer with main products: RFID Tag Flip-Chip Bonding Machine, RFID Flip-Chip Mounter, RFID Bonding Machine, RFID Label, RFID Inlay, RFID Tag, RFID HF Tag, RFID Uhf... |
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>Products Catalog > RFID Tag Flip-chip Bonding Equipments > HIT RFID Tag Flip-chip Bonding Equipment HEI-DIII
HIT RFID Tag Flip-chip Bonding Equipment HEI-DIII
| FOB Price: | 1.00 - 2.00 USD/Set |
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| Supply Ability: | 3 Set/Sets per Quarter |
| Payment Terms: | L/C, D/A, D/P, T/T |
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| Export Markets: | North America, Southeast Asia, Western Europe |
|---|---|
| Place of Origin: | Hubei in China |
| Packaging Details: | Wooden Box |
Quick Details
- After-sales Service Provided: Engineers available to service machinery overseas
- Condition: New
- Model Number: HEI-DIII
- Brand Name: HIT
- Application: RFID Tag Inlay processing
- Technology: Flip-chip Bonding
Specifications
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Specifications:
Adopts flip-chip bonding technology: pick the die chip from the wafer and bond it directly with the antenna then heat and press, the ACA/NCA glue will solidify and the inlay package is achieved, the equipment integrates dispensing, flip patch, final bonding, online testing, rewind and unwind of substrate transporting module and applies to all kinds of HF/UHF RFID tag inlay efficient packaging.
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Features:
- Based on high-precision positioning technology such as the visual image processing guiding, high-speed trajectory-timing planning and closed-loop control of grating precision feedback, achieve to place microchip (minimum 0.3 x 0.3mm2 chip) fast, precisely and cost effective
- Via tension-positioning mixed control or distributed control, achieve to feed and place precisely in multiple amplitude and long-span flexible membrane matching the point-by-point positioning technology, could adapt domestically antenna substrate and make the antenna cost lower more than 50% than imported substrate
- Use time pressure of non
- Newtonian fluid dispensing process control technology to achieve the precise control of the amount of glue and save 30% of the cost compared with traditional dispensing process
- Use the intermittent movement, the tact control technology of the optimized components to improve the stability of the system while reducing the overall energy consumption more than 60%
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Applications:
- It's applicable to various types of HF/UHF inlay packaging of the field applications, logistics management and traceability, merchants anti–counterfeiting and management, manufacturing logistics and monitor
Service Guarantee
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Free Service Charge
ECVV doesn't charge any service fee to Buyers for buying this product.
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ECVV Supply
ECVV is responsible for supply, and provides product quality inspection, fund supervision and supply chain services.
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Product Quality Commitment
ECVV China Sourcing Agent will assess the reputation and supply ability of the factory and conduct field trips to select the high-quality Chinese factories for buyers.
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Deposit Service Commitments
In order to improve the quality of service, ECVV will charge for a 100CNY deposit for the agent purchasing order, and the deposit will be part of subsequent purchasing costs.
After paying a deposit, if the purchasing order is not completed because of unsatisfied ECVV services, ECVV will refund your deposit.
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FOB Price: 0.25-0.30 USD/Piece
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FOB Price: 1.00-999.00 USD/Unit
Min Order: 1 Unit
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