More Super Hard Comapny| Manufacturer
More Super Hard Comapny

China Manufacturer with main products: Abrasive Tools, Resin Bond Diamond Grinding Wheel, Cutting Tools, Pcd Tools, Pcbn Tools, Saw Blade, Pdc Cutter, Vitrified Bond Diamond Wheel

Home  >Products Catalog > Thinning or Back Grinding Wheel

Thinning or Back Grinding Wheel

Payment Terms: L/C, D/A, D/P, T/T, Western Union
Export Markets: North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe

Quick Details

  • Size: 200
  • Type: Abrasive Disc
  • Brand Name: More
  • Material: diamond
  • Grit: 100

Specifications

Thinning or back grinding wheel

 

 wafer back grinding wheels are mainly used for the thinning and fine grinding of the.

Coolant: Oil, emulsion

Workpiece processed: silicon wafer of discrete devices, integrated chips (IC) and virgin,ATM, Melchiorre, Peter Wolters, Diskus, Viotto, Wendt

Material of workpiece: monocrystalline silicon and some other semiconductor materials.

Grinders: SHUWA SGM-6301, NTS Nanosurface-180G, NTS Nanosurface 250/NC-VDM

 

in the middle of the pre-production process, thick silicon wafer can reduce damage; before assembly, silicon wafer is thinned, which is conducive to heat dissipation; reduce package volume; improve mechanical strength (softer after thinning, softer after thinning, minus Small stress); improve electrical performance (short connection); reduce the workload of dicing wafer

 

Vitrified bond diamond grinding wheel bond agent has higher strength; good wear resistance, sharp cutting Grinding efficiency is high, and easy to trim; generally suitable for silicon wafers, such as rough grinding, semi-finishing grinding, etc.

the diamond grinding wheel has good self-sharpening performance and is not easy to clog; the grinding efficiency is high, the grinding force is small, and the grinding temperature is low the bonding agent itself has good elasticity and polishing performance; the workpiece has high surface finish and good surface quality; it is suitable for fine grinding and polishing of silicon wafers.

 

the Specification of Diamond Back Grinding Wheels:

Model

Diameter (Mm)

Thickness (Mm)

Hole (Mm)


6A2

175

30, 35

76

200

35

76

350

45

127


6A2T

195

22.5, 25

170

280

30

228.6


6A2T(Three Ellipses)

350

35

235

209

22.5

158

Other Size Can Ba Made According to Customers Requirements 

 

Silicon wafer back grinding wheel features:

1, surface quality: require grinding lines evenly, without chipping, debris, scribe, etc.;

2, processing accuracy: TTV <5M etc. (Total thinning veracity);

3, processing quality: surface roughness: < 10 nm; damage layer thickness: < 10m;

 

 

Application of back grinding wheel

the grinding wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.

Workpiece processed: sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.

Material of workpiece: synthetic sapphire, single crystal silicon, gallium arsenide and GaN materials. 

the LED substrate thinning grinding wheel is mainly used for the back surface thinning of the sapphire epitaxial wafer, silicon wafer, gallium arsenide and gallium nitride wafer in the LED industry. the grinding LED substrate grinding wheel developed by our company has superior grinding performance and high cost performance. It can be used stably in European, American, Japanese and domestic grinding machines, and can replace imported products. 

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