Bicheng Enterprise Limited

China Manufacturer with main products: High Frequency PCB, RF Circuit Board, Microwave PCB, PCB Prototypes, Impedance PCB, High Tg PCB, Multilayer PCB, RO4350B PCB

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Home  >Products Catalog > Flexible PCB > 2 Layer Flex Printed Circuit Board (FPC) Built on Polyimide for Microstrip Antenna

2 Layer Flex Printed Circuit Board (FPC) Built on Polyimide for Microstrip Antenna SafeBuy Supplier Member

FOB Price: 2.00 - 3.00 USD/Piece
Supply Ability: 500,000 Piece(s) per Month
Shipping: Door to Door
Payment Terms: T/T, Western Union, Other, Paypal
Update Time: 2019/6/22
In Stock
Export Markets: North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Place of Origin: Guangdong in China
Packaging Details: Vacuum

Quick Details

  • Surface Finishing: Immersion gold
  • Board Thickness: 0.20mm
  • Copper Thickness: 70 um
  • Base Material: Polyimide 25um
  • Brand Name: Bicheng Enterprise Limited
  • Min. Line Spacing: N/A
  • Min. Line Width: N/A
  • Min. Hole Size: N/A
  • Model Number: BIC-304-V304
  • Coverlay Colour: Yellow
  • Color of Silkscreen: White

Specifications

Structure of FPC
According to the number of layers of conductive copper foil, FPC can be divided into single
Layer circuit, double layer circuit, multi-layer circuit, double sided and so on. 


Single-layer structure: the flexible circuit of this structure is the simplest structure of the
Flexible PCB. Usually the base material (dielectric substrates) + transparent rubber(adhesive)
+ copper foil is a set of purchased raw materials(semi-manufactures), the protective film and
Transparent glue are another kind of bought raw material. First, copper foil must be etched to
Obtain the required circuit, and the protective film should be drilled to reveal the corresponding
Pad. after cleaning, the two are combined by rolling. Then the exposed part of the pad
Electroplated gold or tin to protect. In this way, the big panel board will be ready. Generally
Also it's stamped into the corresponding shape of the small circuit board. There is also no
Protective film directly on the copper foil, but printed resistance soldering coating, so that
the cost will be lower, but the mechanical strength of the circuit board will become worse.
unless the strength requirement is not high and the price needs to be as low as possible,
It is best to apply the protective film method. 


Double layer structure: when the circuit is too complex to be wired, or copper foil is needed
to shield the ground, it is necessary to choose a double layer or even a multilayer. the most
Typical difference between a multilayer and a single plate is the addition of a perforated structure
to connect the layers of copper foil. the first process of transparent rubber + base material +
Copper foil is to make holes. Drill holes in the base material and copper foil first, clean and then
Plated with a certain thickness of copper. the subsequent fabrication process is almost the same
as the single-layer circuit. 


Double sided structure: both sides of the double sided FPC have pads, mainly used to connect
Other circuit boards. Although it and monolayer structure is similar, but the manufacturing
Process is very different. Its raw material is copper foil, protective film and transparent glue.
the protective film should be drilled according to the position of the pad first, then the copper
Foil should be affixed, the pad and track lines should be etched and then the protective film of
Another drilled hole should be affixed.



FPC Case: 2 Layer Flex Printed Circuit Board (FPC)
Built on Polyimide for Microstrip Antenna

(Flexible printed circuits are custom-made products, the picture and parameters shown are
Just for reference)



General description
this is a type of 2 Layer flexible printed circuit (FPC) built on polyimide for the application
of Microstrip Antenna.


Basic specifications
Base material: Polyimide 25m + 0.3mm stiffener of stainless steel
Layer count: 2 layers
Type: Individual FPC
Format: 205mm x 74mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 70 m/ Inner layer 0 m
Solder mask / Legend: Yellow coverlay / white
Final PCB height: 0.20 mm
Standard: IPC 6012 Class 2
Packing: 100 pieces are packed for shipment. 
Lead time: 10 working days
Shelf life: 6 months

Features and benefits
the end can be whole soldered;
Continuity of processing;
Low cost;
Delivery on time higher than 98% on-time-delivery rate;
Comprehensive equipment management and maintenance and process control;
RoHS materials;
Eligible products rate of first production: >95%  
Diversified shipping method: FedEx, DHL, TNT, EMS

Application
Keypad FPC, mobile phone module flex board, mobile phone module flex boardToy
Lamp strip, industrial surveying and mapping instrument, Consumer electrostatic
Bracelet soft board.


General Properties of 2 Layer FCCL

Test Item Treatment
Condition
Unit Property Date
IPC Standard
* value
Typical Value
SF202
0512DT
SF202
1012DT
Peel Strength (90) A N/mm 0.525 1.2  1.4
288, 5s 0.525 1.2  1.4
Folding Endurance (MIT) R0.8 X 4.9N Times - 80 50
Thermal Stress 288, 20s - - No
Delamination
No
Delamination
Dimensional Stability MD E-0.5/150 % 0.2 0.05 0.05
TD 0.05 0.05
Chemical Resistance after Chemical
Exposure
% 80 85 85
Dielectric Constant (1MHz) C-24/23/50 - 4.0 3.2 3.3
Dissipation Factor (1MHz) C-24/23/50 - 0.01 0.007 0.008
Volume Resistvitiy C-96/35/90 M-cm 10^6 4.5 x 10^8 3.5 x 10^8
Surface Resistance C-96/35/90 M 10^5 1.5 x 10^6 2.0 x 10^6

Explanations:
C = Humidity conditioning;
E = Temperature conditioning;
* Certified to IPC-4204/11 Copper Clad Adhesiveless Polyimide

Product Code Description
SF201 05 12 S E
SF201: Shengyi Adhesiveless FCCL Designation
05: PI Film Thickness, 05- 12.5m; 08-20m
12: Copper Foil Thickness, 12-12m, 18-18m
S: Single Sided
E- ED copper; R- RA Copper

FPC
2 Layer Flex Printed Circuit Board FPC Built on Polyimide for Microstrip Antenna
AOI
2 Layer Flex Printed Circuit Board FPC Built on Polyimide for Microstrip Antenna

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