Bicheng Enterprise Limited

China Manufacturer with main products: High Frequency PCB, RF Circuit Board, Microwave PCB, PCB Prototypes, Impedance PCB, High Tg PCB, Multilayer PCB, RO4350B PCB

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Double Sided Copper Core PCB with OSP SafeBuy Supplier Member

FOB Price: 3.00 - 4.00 USD/Piece
Supply Ability: 500,000 Piece(s) per Month
Shipping: Door to Door
Payment Terms: T/T, Western Union, Other, Paypal
In Stock
Export Markets: North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Place of Origin: Guangdong in China
Packaging Details: Vacuum

Quick Details

  • Surface Finishing: OSP
  • Board Thickness: 2.0mm
  • Copper Thickness: 35-105um
  • Base Material: Thermoelectric Separation (398 W/MK)
  • Brand Name: Bicheng Enterprise Limited
  • Min. Line Spacing: N/A
  • Min. Line Width: N/A
  • Min. Hole Size: N/A
  • Model Number: BIC-0802-V802
  • Solder mask Colour: Black
  • Silkscreen Color: White
  • E-test: 100% open-short circuit test, AOI Test


Copper Based PCB
Copper core PCB is one of the most expensive metal substrates, and its thermal conductivity is
Many times better than that of aluminum and iron substrates. It is suitable for high frequency
Circuits, high and low temperature changing regions and the heat dissipation and building
Decoration industries of precision communication equipment.

Double Sided Copper Core PCB With OSP

Metal Core PCB Case: Double Sided Copper Core PCB
with OSP

(PCB's are custom-made products, the picture and parameters shown are just for reference)

General profile
Board thickness: 2.0mm
Copper weight: 35-105um
Production technology: Exposure technology
Surface finish: Immersion gold, HASL, OSP
Voltage-withstand: AC2500-4000V
Thermal conductivity: Thermoelectric Separation (398 W/MK)
Solder mask: White, Black
E-test: 100% open-short circuit test, AOI Test
Lead time: 2 weeks
Contour: Punch + CNC mill

Metal Core PCB Capability 2019

NO. Parameter Value
1 Type of Metal Core Aluminum, Copper, Iron
2 Model of Metal Core A1100, A5052, A6061, A6063, C1100
3 Surface Finish HASL, Immersion Gold, Immersion Silver, OSP
4 Thickness of Surface plating HASL: Sn>2.54M, ENIG: Au 0.025-0.1m,
Ni 2.5-5m
5 Layer Count 1-4 Layers
6 Maximum of Board Size 23" x 46" (584mm1168mm)
7 Mininum of Board Size 0.1969" x 0.1969" (5mm5mm)
8 Board Thickness 0.0157" x 0.2362" (0.4-6.0mm)
9 Copper Thickness 0.5OZ(17.5m),1OZ(35m),2OZ(70m)
3OZ(105m),4OZ(140m) to 10oz (350m)
10 Minimum Track Width 5mil (0.127mm)
11 Minimum Space 5mil (0.127mm)
12 Minimum Hole Size 0.0197" (0.5mm)
13 Maximum Hole Size No limit
14 Minimum Holes Punched PCB thickness <1.0mm: 0.0394" (1.0mm)
PCB thikness 1.2-3.0mm: 0.0591" (1.5mm)
15 PTH Wall Thickness >20m
16 Tolerance of PTH 0.00295" (0.075mm) 
17 Tolerance of NPTH 0.00197" (0.05mm) 
18 Deviation of Hole Position  0.00394" (0.10mm) 
19 Outline Tolerance Routing: 0.00394" (0.1mm)
Punching: 0.00591" (0.15mm) 
20 Angle of V-cut 30, 45, 60
21 V-cut Size 0.1969" x 47.24" (5mm1200mm)
22 Thickness of V-cut Board 0.0236" x 0.1181" (0.6-3mm)
23 Tolerance of V-cut Angle 5
24 V-CUT Verticality 0.0059" (0.15mm)
25 Minimum Square Slots Punched PCB thickness < 1.0mm: 0.0315" x 0.0315"
(0.8 x 0.8mm)
PCB thickness 1.2-3.0mm: 0.0394" x 0.0394"
(1.0 x 1.0mm)
26 Minimum BGA PAD 0.01378" (0.35mm)
27 Minimum Width of Solder Mask Bridge. 8mil (0.2032mm)
28 Minimum Thickness of Solder Mask >13M (0.013mm)
29 Insulation Resistance 1012Normal
30 Peel-off Strength 2.2N/mm
31 Solder float 260 3min
32 E-test Voltage 50-250V
33 Thermal Conductivity 0.8-8W/M.K
34 Warp or Twist 0.5%
35 Flammability FV-0
36 Minimum Height of Component indicator 0.0059"(0.15mm)
37 Minimum Open Solder Mask on Pad 0.000394" (0.01mm)

the circuit layer of copper substrate is required to have a large current-carrying capacity,
so a thick copper foil should be used, the thickness of which is generally 35 m ~ 280 m; 

Thermal insulation layer is the core technology of copper substrate too. The core thermal
Conductivity is composed of aluminum trioxide and silicon powder and polymer filled with
Epoxy resin, the thermal resistance is low (0.15), viscoelasticity is excellent, and it has the
Ability to resist thermal aging. It is able to withstand mechanical and thermal stress.

Metal base is the support member of copper PCB. It is required to have high thermal
Conductivity, generally copper sheet is used because copper can provide better thermal
Conductivity, suitable for drilling, punching, shearing and cutting and other conventional

Thermoelectric Separation 
A) the heat derived from LED is directly transfer through copper 
B) Thermal conductivity is higher at 380 W/MK 
C) Maximum power output 80 watt 

Copper Core PCB 
1) Single sided, double sided. 
2) Insulated metal substrate (IMS PCB) and Metal core PCB (MCPCB) 
3) V-Groove, Punch, CNC milling 
4) ENIG, HASL, OSP and Immersion tin 
5) Solder mask: Black, White and Green

Double Sided Copper Core PCB With OSP
Double Sided Copper Core PCB With OSP
Automatic test machine
Double Sided Copper Core PCB with OSP
Double Sided Copper Core PCB with OSP

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