More Super Hard Comapny| Manufacturer
More Super Hard Comapny

China Manufacturer with main products: Abrasive Tools, Resin Bond Diamond Grinding Wheel, Cutting Tools, Pcd Tools, Pcbn Tools, Saw Blade, Pdc Cutter, Vitrified Bond Diamond Wheel

Home  >Products Catalog > Back Diamond Thinning Grinding Wheel

Back Diamond Thinning Grinding Wheel

FOB Price: 1.00 - 2.00 USD/Piece
Payment Terms: L/C, D/A
In Stock
Export Markets: North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe

Quick Details

  • Size: 300
  • Type: Abrasive Block
  • Brand Name: MORE
  • Material: Diamond
  • Grit: 800

Specifications

Metal bonded Back grinding wheel

the grinding wheel is mainly used for LED Industry sapphire epitaxial wafer, silicon wafer, gallium arsenide, GaN wafer Back thinning.

the grinding LED substrate grinding wheel Produced by our company can replace imported products with guaranteed quality, Stable use, superior grinding performance and high cost performance.

Features

High precision grinding workpiece, good Surface quality,

Shape retention of the workpiece is good,

High grinding efficiency,

Low grinding force and low grinding Temperature

Resin bond back grinding wheel

Resin thinning grinding wheel takes Thermosetting resin as binder and diamond as grinding particle.Compared with Metal bond and ceramic bond, resin bond grinding wheel has many advantages, Such as abundant elasticity, good self-sharpening and no blockage.Therefore, Resin bonded grinding wheel has high machining efficiency and low machining Heat.

Features

Excellent self-sharpening and elasticity

High machining efficiency and low machining Temperature

High machining precision and surface Quality


Vitrified bond back grinding wheel

Vitrified bond back grinding wheel are Mainly used in the thin and fine machining of semiconductor wafers, with the Characteristic high self-sharpening sharpness of ceramic binders, no need for Online knife sharpening, and at the same time can achieve a higher feed speed To reduce the processing time, at the same time, this product can also give Consideration to a longer service life.

Features

the use of porous ceramic bond, with a Higher self sharpening

High feed speed, up to 500um/min, greatly Improve the processing efficiency

Due to the unique formulation of the Binder, not only the processing quality is excellent, but also the grinding Wheel itself wear is low, can obtain a longer service life

Processing workpiece of Back gtinding wheel

Sapphire wafer silicon wafer gallium Arsenide GaZ

Specification

SD

400

M

254D

5W

10X

Abrasive

grit

bond

Diameter

wide(W)

high(X)

Synthetic

Diamond

270-8000

M-metal

200-304

2-7

5-10

Bond

code

Workpiece

Application

Feature

Diamond

M

Sapphire

Rough grinding

Long life

Vitrified

V

Silicon

Rough/finish grinding

Porous sharp, can be used for ordinary and ultra-thin wafer Processing

Resin

R

Saphire

Rough/finish grinding

High grinding efficiency


Back diamond thinning grinding wheel

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