LP900 Ceramic Heat Sink for Electronic Products

FOB Price:	0.01 - 0.20 USD/Piece
Supply Ability:	1,000,000 Piece(s) per Week
Shipping:	FOB Shenzhen . DHL UPS EMS FEDEX
Payment Terms:	T/T

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Product Details

Export Markets:	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Place of Origin:	Guangdong in China

Quick Details

Rated Voltage: KV/mm
Application: High Voltage
Material: Composite Polymer
Type: Insulator
Brand Name: LTD
Tensile Strength: MPa
Model Number: LP900

Specifications

LP900 Ceramic Heat Sink for Electronic Products

LP900 Ceramic Heat Sink

LP900 is a silicon carbide ceramic heat sink and it belongs to the micro-hole structure. under the same unit area,it can be more than 30% porosity, greatly increasing the heat transfer area with air to enhance its cooling effect. At the same time its heat capacity is small, its heat storage is small and the heat can be more quickly to the outside world. Ceramic heat sink main features: environmental protection, insulation resistance to high pressure, efficient heat, to avoid brewing EMI problems. so it can effectively solve the electronic and home appliance industry thermal and cooling problems, while it is specially for small and medium wattage power consumption, design space pay attention to

Features & Benefits:

the best electronic insulation and avoid the breeding of EMI problems Light weight book, high surface area, good heat radiation, no heat, heat fast Resistant to cold and heat shock, easy to install, no long-term preservation of the quality problem.

Typical applications:

LED: backlight module

TV: Thin LCD TV set top box

Network equipment: AP, Router, ADSL, Modern, S / W, STB Information Technology: M / B, NB, Video, Card

Memory: DDR3-DIMM, so-DIMM, SSD

Power: Power module, power transistor

Physical Properties:

Test Item	Unit	Test Value	Test Method
Color	-	Green/Dark gray	-
Porosity	%	30	ASTM C 373
Water absorption	%	15.77	ASTM D 570-98
Mohs' hardness	N/mm	5-6	DIN EN101-1992
Flexural strength	Kgf/cm	47.5	CNS12701(1990)
Bulk density	g/cm	1.9	ASTM C 373
Resistance Insulation	G	18	1000VDC,1minute
Thermal Conductivity	W/mK	9	HOT DISK
Thermal Diffusivity	mm/s	2.8	HOT DISK
Maximum Operating Temperature		700	-
Dielectric Withstanding Voltage	KV	7	-
Linear Thermal Expansion Coefficient	10-6	4.13	ASTM C 372
Specific Heat	MJ/mK	2.62	HOT DISK
Main Composition	SiC	90%	-
Size	mm	1010/2020/3030/4040/5050/6060

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Product Quality Commitment

ECVV China Sourcing Agent will assess the reputation and supply ability of the factory and conduct field trips to select the high-quality Chinese factories for buyers.
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After paying a deposit, if the purchasing order is not completed because of unsatisfied ECVV services, ECVV will refund your deposit.