Shenzhen Union Tenda Technology Co., Ltd.| Manufacturer

Shenzhen Union Tenda Technology Co., Ltd.

[ Guangdong, China ]
Business Type: Manufacturer
Main Product: Thermal Interface Material, Thermal Insulation Materials, Electronics Thermal Gap Filler, Thermal Filling Gaps, Thermal Grease, Thermal Isolating Material, Thermal Conductivity Silicone Rubber Pad, High Performance TIMs
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Shenzhen Union Tenda Technology Co., Ltd.

China Manufacturer with main products: Thermal Interface Material, Thermal Insulation Materials, Electronics Thermal Gap Filler, Thermal Filling Gaps, Thermal Grease, Thermal...

Home  >Products Catalog > High Thermal Conductive Silicone Pad for Air Gap Filling

High Thermal Conductive Silicone Pad for Air Gap Filling

FOB Price: 0.01 - 0.20 USD/Piece
Supply Ability: 500,000 Piece(s) per Week
Shipping: FOB Shenzhen . DHL UPS EMS FEDEX
Payment Terms: T/T
In Stock
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Export Markets: North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Place of Origin: Guangdong in China

Quick Details

  • Rated Voltage: KV/mm
  • Application: High Voltage
  • Material: Composite Polymer
  • Type: Insulation Sheet
  • Brand Name: LTD
  • Tensile Strength: MPa
  • Model Number: LC200-400

Specifications

High Thermal Conductive Silicon Pad


High Thermal Conductive Silicone Pad for Air Gap Filling
High Thermal Conductive Silicone Pad for Air Gap Filling

High thermal conductive silicone pad is a high thermal conductivity material. The raw material is made of Japan Electrochemical High Thermal Conductive Spherical Alumina Powder and Dow Corning Polymer. It is a cost-effective thermal gap filling material. The surface's natural micro-viscosity and softness can well fill the air gaps to transfer the heat between the heat source and the heat sink to improve heat dissipation and improve the efficiency of heating electro-nic components and service life. It is an ideal thermal interface material.


Features & Benefits:     

L Cost-effective, high conductivity, low thermal resistance

L Soft and flexible, reducing the interface thermal resistance

L High electrical insulation to protect electronic devices

L Natural sticky, easy application, reworkable

Meet ROHS and UL environmental requirements


Typical Applications:  


L High thermal conductivity module

L new energy vehicles

L Microprocessors, memory chips and graphics processors

L Network communication equipment

L Car equipment, charger

High-speed hard disk drive  


Physical Properties:

Test Item

TEst Method

Unit

LC200

LC250

LC300

LC400

Color

Visual

-

Blue

Blue

Blue

Gray

THickness

ASTM D374

mm

0.3~10

0.3~10

0.3~10

0.5~5

HArdness

ASTM D2240

Shore00

40~80

40~80

40~80

60~80

Specific Gravity

ASTM D792

g/cm3

2.5

2.8

3

3.24

TEnsile Strength

ASTM D412

Mpa

0.29

0.25

0.19

0.14

Elongation

ASTM D412

%

45

60

40

32

TEar Strength

GBT 529-2008

KN/m

0.9

0.6

0.9

0.7

BReakdown Voltage

ASTM D149

KV/mm

10

10

10

5

VOlume Resistivity

ASTM D257

cm

51012

71013

11012

11013

Continuous Use Temp

EN344

-40~200

-40~200

-40~200

-40~200

Flame Rating

UL 94

-

V-0

V-0

V-0

V-0

WEight Loss

@150240H

%

0.3%

0.3%

0.3%

0.5%

Dielectric Constant

ASTM D150

@1MHz

5.69

6.79

7.0

6.75

 Thermal Conductivity

ISO 22007-2

W/mK

2.0

2.5

3.0

4.0

Standard size:200mm400mm, 300mm400mm; Customized size available; 

Coated with fiberglass/one side or double side adhesive/aluminum foil available.



for more, please kindly feel free to contact us: rita (at) szutd.com

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