King Sun PCB Technology Co., Ltd.

China Manufacturer with main products: Printed Circuit Boards, BGA Pad, Blind&Buried Vias, Impedance Control PCB, PCB Assembly, Rigid and Flexible PCB, Copper Coin PCB, ENEPIG...

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Small BGA Pad Printed Circuit Board

FOB Price: 0.20 - 3.00 USD/Piece
Payment Terms: T/T
In Stock
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Export Markets: North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Place of Origin: Guangdong in China

Quick Details

  • Surface Finishing: ENEPIG
  • Board Thickness: 0.6mm
  • Copper Thickness: 1/1/1/1 oz
  • Base Material: 0.6mm
  • Brand Name: King Sun

Specifications

Small BGA pad PCB:

Layers: 4 Layer
PCB material: FR4 High Tg(S1000-2)
Board Thickness: 0.6mm
Surface Finishing: 
Finished Copper thickness:1/1/1/1 oz

Special Technology:

  •  Minimum trace width/space: 3/3mil(0.08mm)
  •  Small BGA pad: 3.9mil(0.1mm)
  •  Minimum vias diameter: 6mil(0.15mm)
Small BGA pad Printed Circuit Board

Standard PCB Capability:

Minimum Circuit Trace Width/Space: 2.7/2.7mil
the Minimum Via Size: 0.15mm
the Minimum legend Height/Width: 0.5mm/0.12mm
Surface Finishing: HASL-LF, ENIG,ENEPIG,OSP,Gold Finger,Hard Gold Plating,Immersion Silver,Immersion Tin
Special Technology: Blind&buried via, Via In Pad,Backdrill,Small BGA Pad,Impedance control,Heavy Copper,Copper Filled Vias,Countersink hole,Depth Milling
Material Type: FR4,Metal Core,Halogen Free FR4,Rogers,PTFE,Arlon,Nelco,Polyimide
Final Board Thickness: 0.4mm ~ 6.0mm
Final Copper Thickness: HOZ 1OZ 2OZ 3OZ 4OZ 6OZ 10OZ
FR4 Substrate Thickness: 0.1mm 0.2mm 0.3mm 0.4mm 0.5mm 0.6mm 0.8mm 1.0mm 1.2mm 1.5mm 2.0mm 2.36mm
Shaping: CNC Routing,Punching,V-CUT, Depth milling, Castellation
Special Hole: Blind&buried hole,Depth milling,T-slot,Countersink hole
Quick-turn Lead Time: 1 Day for 2 Layer PCB, 2 Days for 4 Layer PCB, 3 Days for 6 Layer PCB

Service Process

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