Shenzhen Dowell Adhesive Products Co., Ltd.

China Manufacturer with main products: Copper Foil Tape, Protective Film, Functional Protective Film, High Temperature Double-Sided Tape, Adhesive Pads, Pet Double-Sided Tape,...

Home >Products Catalog > Japan Tape UV Release Dicing Films Wafer Cutting Protective Film

Japan Tape UV Release Dicing Films Wafer Cutting Protective Film

FOB Price:	0.10 - 1.50 USD/Square Meter
Supply Ability:	50,000 Square Meter(s) per Week
Payment Terms:	L/C, D/A, D/P, T/T, Western Union, MoneyGram, Safebuy

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Product Details

Export Markets:	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Place of Origin:	Guangdong in China

Quick Details

Brand Name: Dowell
Design Printing: No Printing
Adhesive Type: Pressure Sensitive
Adhesive: Acrylic
Adhesive Side: Single Sided
Model Number: DL-300
Feature: Waterproof
Use: Carton Sealing
Type: UV Protection Pe Film Protective Film
Color: Transparent,blue,white,black and white
Thickness: 0.02-0.15mm++
Product name: UV Film
Width: 20-1650mm
Length: 20~200m
Hardness: soft
Application: Protection of various surface
Size: Custom Size Accepted

Specifications

Dicing films PO protective film UV tape

Product Description

Japan Tape Uv Release Dicing Films Wafer Cutting Protective Film

Name	UV reslease film UV dicing tape dicing film
Brand	Dowell Protective film
Feature	1. after UV curing, the adhesion is very low, and no residue left after removal. 2. Have quick UV reaction time, it can improving efficiency. 3. Before UV curing it has good and reliable adhesion, to protect when cutting. 4. Special structure design is beneficial to tool life.
Thickness	0.02~0.2mm
Material	Polyethylene or PET
Viscosity removal method	Need ultraviolet light illuminate
Caution	Avoid exposure to the sun
usage	UV dicing tape is suitable for: glass cutting protection, polishing, grinding, development, cutting process, small area copper foil and PCB cutting process

Japan Tape Uv Release Dicing Films Wafer Cutting Protective Film

about UV productive film usage

the UV release film can be used for wafer grinding and cutting, ceramic passive components and LED radiator substrate ceramic wafer cutting process, glass substrate polishing and cutting process, so that wafers and other components do not fall off during the grinding and cutting process. after the processing of dispersed exposure to ultraviolet light, the tape is easy to strip from the workpiece; Or the UV tape can temporarily protect the wafer surface from scratches and damage during manufacturing, storage, and transportation of the wafer

Advantage

Keep products and other components from falling off during grinding and cutting. after the processing of dispersed exposure to ultraviolet light, the tape is easy to strip from the workpiece.

or the UV tape can temporarily protect the wafer surface from scratches and damage during manufacturing, storage, and transportation of the wafer. To protect against.

Can be customized according to clients' requirement.

Japan Tape Uv Release Dicing Films Wafer Cutting Protective Film

Service Process

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Service Guarantee

Free Service Charge

ECVV doesn't charge any service fee to Buyers for buying this product.
ECVV Supply

ECVV is responsible for supply, and provides product quality inspection, fund supervision and supply chain services.
Product Quality Commitment

ECVV China Sourcing Agent will assess the reputation and supply ability of the factory and conduct field trips to select the high-quality Chinese factories for buyers.
Deposit Service Commitments

In order to improve the quality of service, ECVV will charge for a 100CNY deposit for the agent purchasing order, and the deposit will be part of subsequent purchasing costs.

After paying a deposit, if the purchasing order is not completed because of unsatisfied ECVV services, ECVV will refund your deposit.