Advantages of Aluminum Nitride Ceramic Circuit Boards

Specifications

Aluminum nitride ceramic circuit boards, I believe this word will not be unfamiliar, as the current highest thermal conductivity of the circuit board, has been the industry's continued concern, we must want to know,What magicDoes aLuminum nitride ceramic substratehavein the end,whyManufacturers areso fascinated to them, soLet me do a comparation for you today  .

Aluminum nitride ceramic circuit board vs epoxy resin circuit board
1.Thermal conductivity:The thermal conductivity of aluminum nitride ceramic circuit board can reachto300W /(mK).the most use of epoxy resin substrate is FR-4, and its average thermal conductivity is 16.5 W/(mK), and this is also due to the high thermal conductivity of the copper layer.the thermal conductivity of aluminum nitride ceramic circuit board is about 20 times of that of epoxy resin circuit board.

2.Coefficient of thermal expansion: COefficient of theePoxy resin thermal expansion substrateisin 14-17 ppm/C, thermal expansion coefficientofAluminum nitride ceramic circuit boardisat 4-5 ppm/C, the thermal expansion coefficient is very close to the silicon chip, thermal expansion coefficient ofSiliconisat 6 ppm/C, and epoxy resin circuit board, a difference of nearly 10 ppm/C, and aluminum nitride ceramic circuit board is only a difference of 2 ppm/C. When the circuit board and the chip are heated at the same time, if the coefficient of thermal expansionbetween themIs too large, the solder joint will fall off directly.
Aluminum nitride ceramic circuit board vs aluminum substrate
1.Thermal conductivity: aluminum substrate as a representative of the metal substrate,Which is the best to beUsed for comparison, but the thermal conductivity of the aluminum substrate is generally in the single Figures, aluminum substrate is a three-layer structure, the top copper foilIs usedfor corrosion circuit. the bottom is the metal base, theMetalBase of aluminum substrate is aluminum, the middle layer is the key technical layer of aluminum substrate, we call it high thermal insulation layer. If weonlyLook the appearance, the aluminum substrate produced by various manufacturers is similar. the core performance of the aluminum substrate is its thermal conductivity, which lies in the middle of the high thermal insulation layer. The insulation thickness of the core is from 70 um to 120 um. The thermal resistance of the core is almost equal to the overall thermal resistance of the aluminum substrate.

2.Coefficient of thermal expansion: The thermal expansion coefficient of the aluminum substrate is 13-18 ppm/C, which is in fact similar to the thermal expansion coefficient of FR-4, and its stability is self-evident.
Aluminum nitride ceramic circuit board vs alumina ceramic circuit board
1.Thermal conductivity: It is also a ceramic circuit board, but there is a big difference. The thermal conductivity of alumina ceramic substrate is about 45 W / L.(mK), the thermal conductivity of aluminum nitride ceramic substrate is nearly 7 times Than it.
2.Coefficient of thermal expansion: The thermal conductivity of alumina ceramic circuit board is basically the same as that of aluminum nitride ceramic circuit board.
Thermal conductivity and thermal expansion coefficient are the most direct performance of the circuit board parameters, I believe we can see the advantages of aluminum nitride ceramic circuit board,  in fact, not just these two points. Aluminum nitride ceramic circuit board can minimize the fragile defects of ceramic circuit board. The hardness of aluminum nitride ceramic circuit board will be much higher than that of alumina ceramic circuit board.

as a leading supplier of aluminum nitride ceramic circuit boards, Sliton is committed to helping the Chinese electronics industry take off and make Chinese ceramic circuit board brands resound all over the world.